Title page for ETD etd-030299-114237

Type of Document Master's Thesis
Author Taminger, Karen M. B.
Author's Email Address K.M.Taminger@LaRC.NASA.GOV
URN etd-030299-114237
Title Analysis of Creep Behavior and Parametric Models for 2124 Al and 2124+SiC Composite
Degree Master of Science
Department Materials Science and Engineering
Advisory Committee
Advisor Name Title
Hendricks, Robert W. Committee Chair
Aning, Alexander O. Committee Member
Brewer, William D. Committee Member
Hyer, Michael W. Committee Member
  • parametric models
  • aluminum
  • metal matrix composite
  • Manson-Haferd parameter
  • creep
  • discontinuously reinforced
Date of Defense 1999-02-11
Availability unrestricted
The creep behavior of unreinforced 2124 aluminum and 2124 aluminum reinforced with 15 w/o silicon carbide whiskers was studied at temperatures from 250 F to 500 F. Tensile tests were conducted to determine the basic mechanical properties, and microstructural and chemical anyalyses were performed to characterize the starting materials. The creep, tensile, and microstructural data for the 2124+SiC composite were compared with a similarly processed unreinforced 2124 aluminum alloy. Applying the basic theories for power law creep developed for common metals and alloys, the creep stress exponents and activation energies for creep were determined from the experimental data. The results were used to identify creep deformation mechanisms and compared to predicted values based on a parametric approach for creep analysis. The results demonstrate the applicability of traditional creep analysis on non-traditional materials.

  Filename       Size       Approximate Download Time (Hours:Minutes:Seconds) 
 28.8 Modem   56K Modem   ISDN (64 Kb)   ISDN (128 Kb)   Higher-speed Access 
  kmbt-msthesis.pdf 1.65 Mb 00:07:37 00:03:55 00:03:26 00:01:43 00:00:08

Browse All Available ETDs by ( Author | Department )

dla home
etds imagebase journals news ereserve special collections
virgnia tech home contact dla university libraries

If you have questions or technical problems, please Contact DLA.