Title page for ETD etd-121399-153938

Type of Document Master's Thesis
Author Siddabattula, Kalyan C.
URN etd-121399-153938
Title Electromagnetic Modeling of Packaging Layout in Power Electronic Modules
Degree Master of Science
Department Electrical and Computer Engineering
Advisory Committee
Advisor Name Title
Boroyevich, Dushan Committee Chair
Lee, Fred C. Committee Member
Lu, Guo-Quan Committee Member
  • Packaging
  • Modeling
Date of Defense 1999-12-03
Availability unrestricted
This thesis presents the modeling approaches and

the challenges involved in electromagnetic

modeling of packaging layout. It discusses the

methodologies that are being used today. It then

applies these methodologies to analyze, model

and characterize three packaging technologies:

(i) the wirebond technology,

(ii) The Metal Post Interconnected Parallel Plate

Structure, and the

(iii) Multi Layer Structure.

The model developed is validated through

experimentation. These models are then used in

simulation in order to compare the electrical

performance of the packaging technologies.

Finally some problems with the existing designs

are pointed out, and suggestions (both local and

generic) are given to improve the layout design.

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