Title page for ETD etd-10072007-173444

Type of Document Master's Thesis
Author Wooddell, Michael Gary
Author's Email Address miwoodde@vt.edu
URN etd-10072007-173444
Title Increased Functionality Porous Optical Fiber Structures
Degree Master of Science
Department Materials Science and Engineering
Advisory Committee
Advisor Name Title
Pickrell, Gary R. Committee Chair
Kampe, Stephen L. Committee Member
Suchicital, Carlos T. A. Committee Member
  • electroless deposition
  • organic photovoltaics
  • nano-porous glass
  • fiber optic sensors
  • silicon chemical vapor deposition
Date of Defense 2007-09-19
Availability unrestricted
A novel fiber optic structure, termed stochastic ordered hole fibers, has been developed

that contains an ordered array of six hollow tubes surrounding a hollow core, combined

with a nanoporous glass creating a unique fully three dimensional pore/fiber

configuration. The objective of this study is to increase the functionality of these

stochastic ordered hole fibers, as well as porous clad fibers, by integrating electronic

device components such as conductors, and semiconductors, and optically active

materials on and in the optical fiber pore structures. Conductive copper pathways were

created on/in the solid core fibers using an electroless deposition technique. A chemical

vapor deposition system was built in order to attempt the deposition of silicon in on the

porous clad fibers. Additionally, conductive poly(3,4-ethylenedioxythiophene)-

poly(styrene sulfonate) (PEDOT:PSS) and photoactive polymer blend poly(3-

hexylthiophene) and 1-(3-methoxycarbonyl)-propyl-1-phenyl-)6,6)C61 (P3HT: PCBM)

were deposited on the fibers using dip coating techniques. Quantum dots of Cadmium

Selenide (CdSe) with particle sizes of ranging from 2- 10 nm were deposited in the

stochastic ordered hole fibers. SEM and EDS analysis confirm that copper, polymer

materials, and quantum dots were deposited in the pore structure and on the surface of the

fibers. Finally, resistance measurements indicate that the electrolessly deposited copper

coatings have sufficient conductivity to be used as metallic contacts or resistive heating


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